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dc.contributor.author Jayathilake, L
dc.contributor.author Baskaran, K
dc.date.accessioned 2014-06-09T16:31:53Z
dc.date.available 2014-06-09T16:31:53Z
dc.date.issued 2014-06-09
dc.identifier.uri http://dl.lib.mrt.ac.lk/handle/123/10003
dc.description.abstract Structurally Insulated Panels (SIPs) are extensively used in energy efficient buildings all over the world. SIPs can be simply introduced as a building material consisting of an insulating layer in between two structural wythes. Since SIP technology is fairly new to Sri Lanka, only few studies have been carried out to check thesuitability of SIP technology in Sri Lanka. SIPs can be used as walling materials, roofing materials and for slab construction instead of conventional building materials such as burnt clay bricks, cement sand blocks or conventional reinforced concrete slabs. This paper describes an experiment carried out to determine the thermal performance of SIP wall, Cement block wall and Burnt clay brick wall model houses. Further,this presents the results obtained from a computer simulation regarding the cooling loads required for above mentioned models. A cost comparison has been done to evaluate the costs of various wall construction techniques used in Sri Lanka. As a whole, this paper describes pros and cons of using SIPs in Sri Lanka. en_US
dc.language.iso en en_US
dc.subject Structurally Insulated Panels , Constructability, Thermal Performance, Insulation en_US
dc.title Pros And Cons Of Using Structurally Insulated Panels In Sri Lanka en_US
dc.type Conference-Full-text en_US
dc.identifier.faculty Engineering en_US
dc.identifier.department Department of Civil Engineering en_US
dc.identifier.year 2014 en_US
dc.identifier.conference Proceedings of Civil Engineering Research Symposium 2014 en_US
dc.identifier.place University of Moratuwa en_US
dc.identifier.pgnos 07 en_US
dc.identifier.proceeding Proceedings of Civil Engineering Research Symposium 2014 en_US
dc.identifier.email LaksriTharanga@gmail.com en_US
dc.identifier.email baskaran@mrt.ac.lk en_US


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