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Development of a high thermal shock resistant ceramic body suitable for cookware applications

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dc.contributor.author Pussepitiya, PPSS
dc.contributor.author Adikary, SU
dc.date.accessioned 2018-06-12T01:41:27Z
dc.date.available 2018-06-12T01:41:27Z
dc.identifier.uri http://dl.lib.mrt.ac.lk/handle/123/13154
dc.description.abstract Development of a ceramic based cookware body with adequate thermal shock resistance was successfully developed using low cost raw materials. The objective of this work was to develop a ceramic body composition suitable for cookware to be used in direct flame cooking. To achieve this objective, cookware body should have low thermal expansion coefficient, high strength, low water absorption and high thermal shock resistance. In this study, ball clay, talc, alumina and zirconium silicate were used as starting raw materials and twenty five samples were investigated with different compositions. All samples were wet-mixed, shaped by slip casting, dried and fired to a temperature of 1250°C in an electric furnace. Modulus of Rupture was tested by the three point bending method, the thermal conductivity of each body was measured with Lee's disk method and the coefficient of thermal expansion was measured by thermo mechanical analyzer. The thermal shock resistance of each sample was calculated with Kingery's formula. Optimum thermal shock resistance of 0.74 kJm-VHvas achieved for a body composition of 45% of clay, 15% of talc, 15% of alumina and 25% of zirconium silicate which was fired to 1250°C. Further, modulus of rupture and coefficient of thermal expansion of the ceramic body were 74 MPa and 30.2*10-7 K-1, respectively. These results suggest that the ceramic body is suitable to be used in cookware applications. en_US
dc.language.iso en en_US
dc.subject Cookware en_US
dc.subject Modulus of Rupture
dc.subject Thermal Shock Resistance
dc.subject Coefficients of Thermal Expansion 1
dc.title Development of a high thermal shock resistant ceramic body suitable for cookware applications en_US
dc.type Article-Abstract en_US
dc.identifier.year 2013 en_US
dc.identifier.journal Annual Transactions of IESL, The Institution of Engineers, Sri Lanka en_US
dc.identifier.pgnos pp. 427 - 431 en_US


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