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Analysing Non-Isothermal Curing Behaviour of Natural Rubber Compounds By Mathematical Modelling of Oscillating Disc Rheometer Curves

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dc.contributor.author Weragoda, VSC
dc.contributor.author Samarasekara, AMPB
dc.contributor.editor Chathuranga, D
dc.date.accessioned 2022-08-19T05:40:49Z
dc.date.available 2022-08-19T05:40:49Z
dc.date.issued 2018-05
dc.identifier.citation V. S. C. Weragoda and A. M. P. B. Samarasekara, "Analysing Non-Isothermal Curing Behaviour of Natural Rubber Compounds By Mathematical Modelling of Oscillating Disc Rheometer Curves," 2018 Moratuwa Engineering Research Conference (MERCon), 2018, pp. 522-526, doi: 10.1109/MERCon.2018.8421920. en_US
dc.identifier.uri http://dl.lib.uom.lk/handle/123/18650
dc.description.abstract This study investigates a novel way of analyzing the rheometer curves obtained from an Oscillating Disk Rheometer (ODR) for predicting the non-isothermal curing characteristics of a rubber compound. A mathematical function is proposed to predict the change in the observed rheometer torque as a function of the temperature to model the state of cure under transient temperature conditions. This was achieved by modeling the rheometer curve with the aid of six temperature dependant parametric constants. The proposed function was observed to accurately describe, the shape of the torque rate at any given temperature. The characteristics variation of the parametric constants too have been briefly examined. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.relation.uri https://ieeexplore.ieee.org/document/8421920 en_US
dc.subject Natural Rubber en_US
dc.subject Vulcanization Modeling en_US
dc.title Analysing Non-Isothermal Curing Behaviour of Natural Rubber Compounds By Mathematical Modelling of Oscillating Disc Rheometer Curves en_US
dc.type Conference-Full-text en_US
dc.identifier.faculty Engineering en_US
dc.identifier.department Engineering Research Unit, University of Moratuwa en_US
dc.identifier.year 2018 en_US
dc.identifier.conference 2018 Moratuwa Engineering Research Conference (MERCon) en_US
dc.identifier.place Moratuwa, Sri Lanka en_US
dc.identifier.pgnos pp. 522-526 en_US
dc.identifier.proceeding Proceedings of 2018 Moratuwa Engineering Research Conference (MERCon) en_US
dc.identifier.email sampathw@uom.lk en_US
dc.identifier.doi 10.1109/MERCon.2018.8421920 en_US


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