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dc.contributor.author Udayanga, TDI
dc.contributor.author Jayathilaka, WADM
dc.contributor.author Amarasinghe, YWR
dc.contributor.author Dao, DV
dc.contributor.editor Jayasekara, AGBP
dc.contributor.editor Bandara, HMND
dc.contributor.editor Amarasinghe, YWR
dc.date.accessioned 2022-09-08T09:07:46Z
dc.date.available 2022-09-08T09:07:46Z
dc.date.issued 2016-04
dc.identifier.citation T. D. I. Udayanga, W. A. D. M. Jayathilaka, Y. W. R. Amarasinghe and D. V. Dao, "Design and simulation of MEMS based 5-DOF tactile force sensor," 2016 Moratuwa Engineering Research Conference (MERCon), 2016, pp. 42-47, doi: 10.1109/MERCon.2016.7480113. en_US
dc.identifier.uri http://dl.lib.uom.lk/handle/123/18990
dc.description.abstract This paper describes design and simulation of five degrees of freedom (5-DOF) Micro-Electro-Mechanical systems (MEMS) based tactile force sensor. Tactile sensing involves with measuring physical parameters such as force, temperature, etc. with the aid of physical touch. Over the past decades tactile sensors are gaining popularity over non-contact sensors in biomedical and robotic applications. Proposed sensor design with 3mm x 3mm x 300μm dimensions, has the capability to measure not only the magnitude but also the direction of the force applied. A wagon wheel spring structure was proposed, where 8 beams work as springs to relief the force applied. Behavior of these 8 beams are monitored under each loading conditions using defused piezoresistive sensing elements. A finite element analysis of structure was performed to optimize and validate the structure and Multiphysics analysis was performed to validate the working principal of the proposed sensor. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.relation.uri https://ieeexplore.ieee.org/document/7480113 en_US
dc.subject Microsensors en_US
dc.subject Tactile Sensors en_US
dc.subject Force Sensors en_US
dc.title Design and simulation of mems based 5-dof tactile force sensor en_US
dc.type Conference-Full-text en_US
dc.identifier.faculty Engineering en_US
dc.identifier.department Engineering Research Unit, University of Moratuwa en_US
dc.identifier.year 2016 en_US
dc.identifier.conference 2016 Moratuwa Engineering Research Conference (MERCon) en_US
dc.identifier.place Moratuwa, Sri Lanka en_US
dc.identifier.pgnos pp. 42-47 en_US
dc.identifier.proceeding Proceedings of 2016 Moratuwa Engineering Research Conference (MERCon) en_US
dc.identifier.email t.i.udayanga@ieee.org en_US
dc.identifier.email ranama@mech.mrt.ac.lk en_US
dc.identifier.doi 10.1109/MERCon.2016.7480113 en_US


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