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Lead free solder compatibility improvement on nichrome alloy through contact angle modification
Kumarasiri, A
;
Attygalle, D
;
Amarasinghe, DAS
Development of a method to measure contact angles of sessile droplets to analyze and enhance the surface wettability of nichrome
Kumarasiri, AAAP
;
Amarasinghe, DAS
;
Attygalle, D
(
Department of Materials Science and Engineering
,
2020-02
)
Effects of current density on the solder wettability of nickel electrodeposited ni20cr alloy
Kumarasiri, A
;
Herath, HS
;
Amarasinghe, DAS
;
Attygalle, D
(
IEEE
,
2021-07
)
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Author
Amarasinghe, DAS (3)
Attygalle, D (3)
Kumarasiri, A (2)
Herath, HS (1)
Kumarasiri, AAAP (1)
Subject
Contact angle (3)
Wettability (3)
Nichrome (2)
Solderability (2)
Current density (1)
Electroplating (1)
Nickel coating (1)
Passivation (1)
Passivity breakdown (1)
Strain Gauge (1)
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Date Issued
2021 (1)
2020 (1)