Pros And Cons Of Using Structurally Insulated Panels In Sri Lanka

dc.contributor.authorJayathilake, L
dc.contributor.authorBaskaran, K
dc.date.accessioned2014-06-09T16:31:53Z
dc.date.available2014-06-09T16:31:53Z
dc.date.issued2014-06-09
dc.description.abstractStructurally Insulated Panels (SIPs) are extensively used in energy efficient buildings all over the world. SIPs can be simply introduced as a building material consisting of an insulating layer in between two structural wythes. Since SIP technology is fairly new to Sri Lanka, only few studies have been carried out to check thesuitability of SIP technology in Sri Lanka. SIPs can be used as walling materials, roofing materials and for slab construction instead of conventional building materials such as burnt clay bricks, cement sand blocks or conventional reinforced concrete slabs. This paper describes an experiment carried out to determine the thermal performance of SIP wall, Cement block wall and Burnt clay brick wall model houses. Further,this presents the results obtained from a computer simulation regarding the cooling loads required for above mentioned models. A cost comparison has been done to evaluate the costs of various wall construction techniques used in Sri Lanka. As a whole, this paper describes pros and cons of using SIPs in Sri Lanka.en_US
dc.identifier.conferenceProceedings of Civil Engineering Research Symposium 2014en_US
dc.identifier.departmentDepartment of Civil Engineeringen_US
dc.identifier.emailLaksriTharanga@gmail.comen_US
dc.identifier.emailbaskaran@mrt.ac.lken_US
dc.identifier.facultyEngineeringen_US
dc.identifier.pgnos07en_US
dc.identifier.placeUniversity of Moratuwaen_US
dc.identifier.proceedingProceedings of Civil Engineering Research Symposium 2014en_US
dc.identifier.urihttp://dl.lib.mrt.ac.lk/handle/123/10003
dc.identifier.year2014en_US
dc.language.isoenen_US
dc.subjectStructurally Insulated Panels , Constructability, Thermal Performance, Insulationen_US
dc.titlePros And Cons Of Using Structurally Insulated Panels In Sri Lankaen_US
dc.typeConference-Full-texten_US

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